Prof. Dr.-Ing. Ulrich Tetzlaff

Programme director and Academic advisor Material Science in Engineering (Master)
Room:
A232
Subject Area:
Materials Science, Chipless Manufacturing Technology and Advanced Composites
Research
- Creep and fatigue behaviour of metallic composites
- Tribology of metallic composites
- High-temperature behaviour of lead-free solder materials
Vita
- Since 2009: Professor at THI, Laboratory Officer of the Faculty of Mechanical Engineering, Head of the Materials Analysis Laboratory
- 2001-2008: AUDI AG: Metallurgy of Aggregates
- 1990-2000: Studies in Materials Science, Research Assistant at the Institute for General Material Properties, PhD
Publications
2025
GÜLDALI, Derya, Angela DE ROSE, Max MITTAG, Benjamin GRÜBEL, Holger NEUHAUS und Ulrich TETZLAFF, 2025. Interconnection of low-temperature metallization on silicon solar cells - The role of silver in tin-bismuth-based solder alloys. Solar Energy Materials and Solar Cells, 2025(285), 113488. ISSN 1879-3398. Available at: https://doi.org/10.1016/j.solmat.2025.113488