Prof. Dr. Gordon Elger

Research

• Institute for Innovative Mobility (IIMo), Research Group "Microelectronics Packaging"
• Head of Fraunhofer Application Center »Connected Mobility and Infrastructure«

Vita

• Since 2016 Research Professor Assembly and Connection Technology
• Since 2013 at THI
• 1999 - 2002, Fraunhofer Institut for Reliability and Microintegration, Scientific Coworker
• 2002 - 2004, Hymite GmbH Berlin, Teamleader Microelectronic Packaging
• 2005 - 2007, Electrolux Italy, R&D Manager CAE (Structural Analysis and Heatmanagement)
• PhD, Free University of Berlin
• Physics studies, Free University of Berlin

Publications

• Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks, A. Zippelius, A. Hanß, M. Schmid, J. Perez-Velazquez, G. Elger, Microelectronics Reliability 129 (2022) 114461, doi.org/10.1016/j.microrel.2021.114461
• Die-attach bonding with etched micro brass metal pigment flakes for high power electronics packaging, S. K. Bhogaraju, H. R. Kotadia, F. Conti, A. Mauser, T. Rubenbauer, R. Bruetting, M. Schneider-Ramelow, G. Elger, ACS Applied Electronic Materials, 2021, Article ASAP, DOI: 10.1021/acsaelm.1c00721
• Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry, A. Theissler, J. Perez-Velazquez, M. Kettelgerdes, G. Elger, Reliability Engineering & System Safety, 2021, 215(19):107864, DOI:10.1016/j.ress.2021.107864
• Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics, M. Schmid, S. K. Bhogaraju, E Liu, G. Elger,  2020, Applied Sciences 10(23):8516, DOI: 10.3390/app10238516
• Analysis of Thermomechanical Stress in GaN LEDs Soldered on Cu Substrate by Finite Element Method and RAMAN Spectroscopy, E Liu, F. Conti , S.K. Bhogarajua, R. Signorini, D. Pedron, B. Wunderle, G. Elger, Journal of Raman Spectroscopy 2020;1–12, DOI: 10.1002/jrs.5947