Benchtop reflow oven with capability of formic acid atmosphere

Equipment description

The RSS-160-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.
The reflow solder system is perfect for the following applications:

• Flux-less soldering
• Flip chip process
• Adhesive bonding
• Solder bump reflowing
• Encapsulation of housings
• Soldering of power devices
• Heat treatment of semiconductor wafers    

Equipment information