Equipment description

SAM uses ultrasound waves to image interfaces and detect possible defects such as voids and cracks within optically opaque structures and components such as chip capacitors, chip resistors, circuit board traces, discrete semiconductor devices, integrated circuits (ICs), and other electronic components.
This SAM is capable of:

  • Scanning JEDEC trays or a 300mm wafer,
  • Water recirculation and optional inline temperature control,
  • Digital Image Analysis (DIA)™ using advanced algorithms to quantify the acoustic data to set accurate, automatic, accept/reject criteria,
  • Virtual Rescanning Mode (VRM)™ that stores comprehensive data and enables performing a complete analysis of a sample, even when it is no longer available.

 

Equipment information

Manufacturer

Nordson Sonoscan

ModelD9600
LocationC307
ContactDipl. Ing. (FH) Kirsten Windhorn-Witt

 

Laboratory Engineer

Lab engineer
Dipl. Ing. (FH) Kirsten Windhorn
Phone: +49 841 9348-2844
Room: C307
E-Mail:

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.