Project description

The work can be divided into 3 main areas:

  •    Materials research: copper formate based complex and then a hybrid copper paste as a combination of surface modified flakes and copper complex.
  •   Sintering process: the process will be optimized mainly from the aspects of high volume shrinkage due to the decomposition of the copper formate and the identification and control of possible impurities generated by the formate sublimation.
  • Characterization and validation: the sintered interconnects will be validated through thermal, electrical and mechanical characterization by both non-destructive analysis (transient thermal analysis, Raman spectroscopy, acoustic microscopy) and destructive testing (shear strength, creep measurements). This is an iterative process that runs in parallel with step (1) and (2), validating the scientific objectives.

 

 

Project information

Tasks THIMaterial development

Project partner

Nano-Join GmbH, Technische Hochschule Ingolstadt, Technische Universität Chemnitz, Dr. O.K. Wack Chemie GmbH - Zestron Europe, Berliner Nanotest und Design GmbH, Budatec GmbH
Project sponsorFederal Ministry of Education and Research
Project term01/08/2022 until 30/04/2025
  
  
  
  

Open positions

If you are interested in vacancies for student work within the research group, please send an email with CV to assistenz-iimo-elger.de.